Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.
The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration.
【Features】
- Three-dimensional shape measurement over a wide area
Maximum line width of 20mm
- Wide tolerance angle
Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes
- Contributes to reduced development costs and shortened development lead times,
with a compact unit and a software development kit for equipment integration (such as DLLs) also available
- Rich track record across multiple industries
Semiconductor industry, consumer electronics, glass manufacturing, medical field
*For more details, please refer to the documentation.
![[Data] Products for consumer electronics manufacturing processes](https://image.mono.ipros.com/public/product/image/6ce/2000505476/IPROS24544410979272537372.png?w=280&h=280)
